HPE Intel Xeon 6724P 3.6GHz 16-core 210W Processor for
- Brand: HPE
- Category:
- SKU: P74509-B21
- EAN: 0190017743417
Intel Xeon 6724P 3.6GHz 16-core 210W Processor for HPE
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
INT Xeon 6724P CPU for HPE |
P74509-B21 | |||
|
INT Xeon 6724P CPU for HPE |
6658577 |
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Description
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Specifications
| Processor | |
|---|---|
| Processor base frequency | 3.6 GHz |
| Processor manufacturer | Intel |
| Processor codename | Granite Rapids |
| Thermal Design Power (TDP) | 210 W |
| Processor cache | 72 MB |
| Processor ARK ID | 242670 |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Processor socket | LGA 4710 |
| Processor model | 6724P |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.3 GHz |
| Processor cache type | L3 |
| Package type | Tray |
| Intel® UPI Speed | 24 GT/s |
| All core Turbo frequency | 4.2 GHz |
| Memory | |
| Maximum internal memory supported by processor | 4 TB |
| Memory types supported by processor | DDR5-SDRAM |
| Memory clock speeds supported by processor | 6400 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 210 W |
| Features | |
| Maximum number of PCI Express lanes | 88 |
| Thermal Design Power (TDP) | 210 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 242670 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, AVX, AVX 2.0, AVX-512, SSE4.2 |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel® OS Guard | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel® Secure Key | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 512 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® Total Memory Encryption - Multi Key | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® QuickAssist Technology (QAT) | 2 default devices |
| Intel® Dynamic Load Balancer (DLB) | 2 default devices |
| Intel® Data Streaming Accelerator (DSA) | 2 default devices |
| Intel® In-memory Analytics Accelerator (IAA) | 2 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Intel® Speed Select Technology – Core Power | Yes |
| Intel® Speed Select Technology – Turbo Frequency | No |
| Intel® Trust Domain Extensions (Intel® TDX) | Yes |
| Operational conditions | |
| Tcase | 74 °C |
| DTS Max | 103 °C |
| Technical details | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 210 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E2B |
| Packaging data | |
| Package type | Tray |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Width | 36.6 mm |
| Depth | 222.3 mm |
| Height | 287.3 mm |
| Weight | 680 g |
| Other features | |
| Height (imperial) | 28.7 cm (11.3") |
| Weight (imperial) | 0.68 kg (1.5 lbs) |
