Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
HP CPU Kit E5-2667 X2.9GHz-15Mb/1600 6C 130W 8.0GT/s DL380p G8 |
662214-B21 |
Related Products
Description
The Intel Xeon E5 delivers up to 2.1 times more performance in raw FLOPS (Floating Point Operations Per Second as measured by Linpack*) and up to 70 percent more performance using real-HPC workloads compared to the previous generation of Intel Xeon 5600 series processors.
Specifications
| Processor | |
|---|---|
| Processor base frequency | 2.9 GHz |
| Memory bandwidth supported by processor (max) | 51.2 GB/s |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 15 MB |
| Processor family | Intel® Xeon® E5 Family |
| Processor cores | 6 |
| Processor socket | LGA 2011 (Socket R) |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Box | No |
| Processor model | E5-2667 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.60 - 1.35 V |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 750 GB |
| Memory clock speeds supported by processor | 800,1066,1333,1600 MHz |
| Memory bandwidth supported by processor (max) | 51.2 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| VID Voltage Range | 0.60 - 1.35 V |
| Features | |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Operational conditions | |
| Maximum operating temperature | 85 °C |
| Technical details | |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Processor cache type | L3 |
